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New DIPIPM+™ Series Module with All-in-one integrated
A new series of DIPIPM+™ power module with all-in-one internal circuit and compact size for industrial applications.
A 1700V-IGBT module and IPM with new insulated metal baseplate (IMB) featuring enhanced isolation properties and thermal conductivity
An enhanced module insulating technology IMB (Insulated Metal Baseplate) that features a high thermal conductivity and insulation properties and its application to IGBT module and IPM are presented.
New Transfer Mold DIPIPM utilizing silicon carbide (SiC) Mosfet
A new transfer mold type full Silicon Carbide (SiC) super-mini DIPIPMTM developed for small capacity motor drive system in both home appliances and industrial applications that higher energy-saving efficiency is needed.
Resin Encapsulation Combined with Insulated Metal Baseplate for Improving Power Module Reliability
A newly developed packaging technology in combination with direct potting (DP) resin and Insulated Metal Baseplate (IMB) is presented
